DDRx 仿真分析背景介绍

Board dimension: 19x9.8cm

12 layer，1.6mm thickness ,FR4

SoC: 17x17mm,0.8mm pitch

Critical power net: VDDQ 1.1V, 2A

Two LPDDR4 32bit 4266Mbps Channel

All DQ signals routed in two layers with
considerations of SSN and Crosstalk

SERDES 通道分析

PCIe gen 4 ,x16,16Gbps

12 layer，1.6mm thickness ,IT180

Passive channel optimization：

1）package 2) Via 3) Caps 4) Connector